Qualcomm releases first batch of next year’s chips
Qualcomm, one of the largest fabless mobile chip manufactures in the world, has announced the availability of samples of its next-gen dual-carrier HSPA+ and multi-mode 3G/LTE chipsets. Hello Future! So, what’s the big deal? According to Qualcomm, These chipsets demonstrate significant progress toward enabling the mass-market commercial deployment of two next-generation network technologies that bring more advanced data capabilities to mobile devices for new global markets in addition to North America. Dual-carrier HSPA+ and LTE are network innovations that provide the ability to deliver more advanced data capabilities to mobile devices, supporting more compelling applications and richer …
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